PCB West 2010
September 28 - 30, 2010
Santa Clara Convention Center
Santa Clara, CA
www.pcbwest.com

Contact Fidus to set up a meeting

DesignCon 2011
Booth #611
February 1 - 2, 2011
Santa Clara Convention Center, Santa Clara

Contact Fidus to set up a meeting

Fundamentals of PC-Board Design: DDR2 and DDR3 Memory Signal Integrity
Sponsored by Mentor Graphics, presented by Dr.Syed Bokhari, Lead Signal Integrity and EMC Specialist, Fidus Systems

Course Description
Double Data Rate memories DDRx have become new standards in today's memory applications. This course describes fundamentals of DDR2 and DDR3 from a signal Integrity perspective. The main signal groups and their synchronism requirements are identified. Net topologies, trace impedances and terminations play an important role in waveform integrity. Trace length, vias and cross talk play an important role in timing.

The effect of these parameters is explained. In the course of a design, one would place constraints and carry out PCB routing. However, post-route verification can become a tedious task. The Hyperlynx DDRx Batch mode capability combines a comprehensive signal integrity analysis with timing analysis. Its usage to optimize and validate a DDRx implementation is presented.

Now Available - Estimated Time - 50 min
Get more information here

IEEE Technical Presentation hosted jointly by the IEEE Ottawa EMC Chapter, and the IEEE Ottawa MTT/AP Chapter

Date: June 29, 2010
Topic:Automotive EMC

Contact Dr. Syed Bokhari, Chairman, IEEE Ottawa EMC chapter Syed.Bokhari@fidus.ca for details

IEEE Technical Presentation hosted jointly by the IEEE Ottawa EMC Chapter, and the IEEE Ottawa MTT/AP Chapter

Date: June 21, 2010
Topic: Current and Upcoming EMC Standards for ITE and Multimedia Equipment

Contact Dr. Syed Bokhari, Chairman, IEEE Ottawa EMC chapter Syed.Bokhari@fidus.ca for details

IEEE Distinguished Lecturer Presentation hosted jointly by the IEEE Ottawa EMC Chapter, and the IEEE Ottawa MTT/AP Chapter

Date: May 4, 2010
Topic: Electromagnetic Band Gap Structures for Noise Mitigation in Printed Circuit Boards and Packages

Contact: Dr. Syed Bokhari, Chairman, IEEE Ottawa EMC chapter Syed.Bokhari@fidus.ca for details

IEEE Distinguished Lecturer Presentation hosted jointly by the IEEE Ottawa EMC Chapter, and the IEEE Ottawa MTT/AP Chapter
November 2, 2009

Contact Dr. Syed Bokhari, Chairman, IEEE Ottawa EMC chapter Syed.Bokhari@fidus.ca for details

IEEE  Distinguished Lecturer Presentation hosted jointly by the IEEE Ottawa EMC Chapter, and the IEEE Ottawa MTT/AP Chapter
June 4, 2009

Contact Dr. Syed Bokhari, Chairman, IEEE Ottawa EMC chapter Syed.Bokhari@fidus.ca for details

Fidus held an IEEE Distinguished Lecturer Presentation hosted jointly by the IEEE Ottawa EMC Chapter and the IEEE Ottawa MTT/AP Chapters.
Thursday, April 2, 2009

Abstract: Dr. Quibo Ye, Chairman of the IEEE Ottawa MTT/AP Chapters Qiubo Ye qiubo.ye@crc.ca

Fidus Systems and Macadamian held an informative panel on the benefits of outsourcing your product development over lunch hosted by the York Technology Association.

To Market, To Market - Minimize your risk and maximize your return
Thursday, Feb 26, 2009

Dr. Syed. Bokhari,
Lead Signal Integrity and EMC Specialist
Fidus Systems

A common approach to reducing radiated emissions from heat sinks is multipoint grounding. These reduce PCB routing area and can become impractical. This paper examines the effect of using a dissipative-edge termination scheme. This consists of resistive loading of the edges of the heat sink. Analysis carried out using a 3D EM field solver shows that 10–20 dB of reduction in the near-field strength is feasible with a proper choice of resistance. Heat sinks of the blade fin and pin fin types have been analyzed in detail and the advantages and limitations of this method will be presented.

View the video interview