Throughout the year, Fidus participates in many events from industry tradeshows to webcasts to speaking engagements. Please review our upcoming events to see where we will be next.
 Upcoming Events |
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 Fundamentals of PC-Board Design: DDR2 and DDR3 Memory Signal Integrity
Sponsored by Mentor Graphics, presented by Dr.Syed Bokhari, Lead Signal Integrity and EMC Specialist, Fidus Systems
Course Description
Double Data Rate memories DDRx have become new standards in today's memory applications. This course describes fundamentals of DDR2 and DDR3 from a signal Integrity perspective. The main signal groups and their synchronism requirements are identified. Net topologies, trace impedances and terminations play an important role in waveform integrity. Trace length, vias and cross talk play an important role in timing.
The effect of these parameters is explained. In the course of a design, one would place constraints and carry out PCB routing. However, post-route verification can become a tedious task. The Hyperlynx DDRx Batch mode capability combines a comprehensive signal integrity analysis with timing analysis. Its usage to optimize and validate a DDRx implementation is presented.
Now Available - Estimated Time - 50 min
Get more information here |
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| Fidus Past Events |
ENavigation
November 17 - 18, 2009
Bell Harbor Conference Center
Seattle, WA
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IEEE Distinguished Lecturer Presentation hosted jointly by the IEEE Ottawa EMC Chapter, and the IEEE Ottawa MTT/AP Chapter
November 2, 2009
Contact Dr. Syed Bokhari, Chairman, IEEE Ottawa EMC chapter Syed.Bokhari@fidus.ca for details |
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PCB West 2009
Sept 15 – 16, 2009
Santa Clara Marriott,
Santa Clara, CA |
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IEEE Distinguished Lecturer Presentation hosted jointly by the IEEE Ottawa EMC Chapter, and the IEEE Ottawa MTT/AP Chapter
June 4, 2009
Contact Dr. Syed Bokhari, Chairman, IEEE Ottawa EMC chapter Syed.Bokhari@fidus.ca for details |
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PCB East 2009
April 27 – May 1, 2009
Westin Waltham-Boston
Waltham, MA,
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Fidus held an IEEE Distinguished Lecturer Presentation hosted jointly by the
IEEE Ottawa EMC Chapter and the IEEE Ottawa MTT/AP Chapters.
Thursday, April 2, 2009
Abstract: Dr. Quibo Ye, Chairman of the IEEE Ottawa MTT/AP Chapters Qiubo Ye qiubo.ye@crc.ca |
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Fidus Systems and Macadamian held an informative panel on the benefits of outsourcing your product development over lunch hosted by the York Technology Association.
To Market, To Market - Minimize your risk and maximize your return
Thursday, Feb 26, 2009
Location: Delta Markham Hotel
Moderator: Jim Roche, President & CEO of Stratford Managers Corporation |
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DesignCon 2009
Feb 3-4, 2009
Santa Clara Convention Center
Santa Clara, CA
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Dr. Syed. Bokhari,
Lead Signal Integrity and EMC Specialist
Fidus Systems
A common approach to reducing radiated emissions from heat sinks is multipoint grounding. These reduce PCB routing area and can become impractical. This paper examines the effect of using a dissipative-edge termination scheme. This consists of resistive loading of the edges of the heat sink. Analysis carried out using a 3D EM field solver shows that 10–20 dB of reduction in the near-field strength is feasible with a proper choice of resistance. Heat sinks of the blade fin and pin fin types have been analyzed in detail and the advantages and limitations of this method will be presented.
View the video interview |
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