Fidus delivers Signal Integrity (SI), Power Integrity (PI) and Electromagnetic Compatibility (EMC) analysis for on-chip IC (Integrated Circuit) design, Package design, Printed Circuit Board (PCB) and System design. Working closely with our customers, we assess their specific system challenges. From chips and memory testers, to wireless, telecom, High Performance Computing and aerospace applications, Fidus develops solutions for the most demanding SI requirements. Averaging 20 years’ experience, our experts are well respected leaders in the Signal Integrity community.

• Layer stack-up and net topology design
• Pre-layout, during layout, and post-route, high-speed signal integrity analysis and simulation for
• Verifying good signal quality
• Reducing Signal reflections
• Increasing Timing margins
• Reducing Crosstalk
• Enhancing Power Integrity through cost effective Decoupling design
• Simultaneous Switching Noise (SSN) reduction, and
• Reducing conducted and radiated Emissions
• Specific Absorption Rate (SAR) analysis

Download the Fidus Signal Integrity/EMC Overview

Integrated Circuit (IC, or on-chip) Design Analysis SSO noise reduction IC inductor and transmission-line modelling Simulation test bench creation DDR2/3 controller characterization and optimization Jitter analysis Generation of design guidelines,  AC characteristics and data sheets On-chip inductor for a wireless Integrated Circuit (IC)	Package Design Package and connector electromagnetic modelling in 3D, leading to equivalent circuits or s - parameters Wirebond and flipchip package design with electrical constraints on impedance, cross-talk and delay Optimization of interconnects for frequencies up to 12 GHz   Gbps differential pair package layout
Printed Circuit Board (PCB) Analysis                                             Printed Circuit Board (PCB)–level modelling and constraint management Creation of topology templates and routing guidelines Pre- and Post route simulation Printed Circuit Board Signal Integrity (PCBSI)	System Design                                             Power, grounding, decoupling and filtering analysis Multi-board system simulations High-speed backplanes Multi-Gigabit serial links 3D Enclosure modelling for EMI Specific Absorption Rate (SAR) computation Low frequency SAR in the skin layer due to a loop antenna

Project Examples Include:

• 1066  Mbps DDR2, and 1600 Mbps DDR3 Evaluation Platform
• 20 GHz PCB interconnects for ASIC Evaluation Platforms
• 3.125 Gbps and 10G Base-KR  Backplane Modelling
• 10/100 Mbps Ethernet, 100 MHz multi-drop SDRAM interface, USB 2.0, HDI, Hypertransport, Infiniband, Rapid IO, DDR, DDR2, DDR3, RLDRAM, GigE, XAUI, PCI Express Gen. 2, XLAUI, 10G Base-KR

Simulation Software Tools:
Fidus maintains licences for:

• Ansoft HFSS
• Ansoft Designer
• Cadence Allegro PCB SI (SPECCTRAQuest)
• Cadence PSPICE
• Synopsys HSPICE
• Mentor Graphics HyperLynx

We are also experienced with:

• Cadence Virtuoso
• Cadence Analog Artist
• Cadence Spectre

Laboratory Facilities:
The Fidus laboratory is equipped with:

• Agilent’s  Infinium 8 GHz DSA and Tektronix Oscilloscopes
• Advantest VNA
• Advantest Spectrum Analyzer
• RF Signal Generators

From targeted consulting to turn-key design, Fidus helps you get your product to market.

• System architecture to board design, circuit simulation, PCB layout, schematics and gerbers
• Component & system characterization, measured or simulated including full S-parameters, gain & noise figure optimization
• Fully documented Design Validation & Functional Testing
• Shield designs for both compliance and sensitive signal preservation

Want to learn more? Have questions? Call us toll-free in North America at +1.866.883.4387 or at +1.613.828.0063. You can also email us at info@fidus.com. To find the Fidus representative nearest you, view our sales network.