Fidus is an engineering powerhouse when it comes to experience with high speed designs involving multi-gigabit backplanes, multi-layer circuit boards, high speed standards (such as PCIe and RapidIO) and DDR2/3 memory. Fidus has worked on designs connecting devices, backplanes, and subsystems that require high-speed serial data rates of up to 10Gbps, with signal integrity and maximum system throughput. Common requirements of high speed designs are high performance, low power consumption using small and complex layout configurations which makes the integration of signal integrity and timing analysis with layout absolutely critical.

Fidus has considerable bench strength in both Signal Integrity and PCB Layout. Our high-speed system design experience will help you identify signal integrity and timing problems and prevent common causes of high-speed design failure such as crosstalk and under/overshoot. A world class expert on signal integrity, Dr. Syed Bokhari, leads the Fidus team of signal integrity experts who provide customers with the industry’s leading signal integrity analysis and simulation with access to the best tools.

The combination of our leadership role in signal integrity and our skills and experience in high speed system level embedded design provides our customers with a unique development solution - helping them to optimize budget, schedule and performance requirements for their high-speed designs. Our customers save precious development time and eliminate the need for costly board re-spins which results in their ability to deliver high quality products to market ahead of the competition.

Project Spotlight

40G Optical Line Cards
Fidus developed a hardware platform to facilitate verification of IP cores for an optical line card utilizing FPGAs in the data path. This reference design provides a 40Gb/sec optical transponder compliant with the OC-768 SONET and STM-256 standards, and interfaces this to a XAUI based backplane running multiple 3.125Gbits/sec links. For this project, Fidus delivered an initial architectural analysis for customer approval before proceeding with schematic capture, PCB layout design and signal integrity analysis. Fidus managed the PCB fabrication and build process, and then tested the final products to ensure they met the customer’s requirements.

Want to learn more? Have questions? Call us toll-free in North America at +1.866.883.4387 or at +1.613.828.0063. You can also email us at info@fidus.com. To find the Fidus representative nearest you, view our sales network.